Our factory utilizes advanced Chip on Board (COB) technology ensuring microchips are fastened on printed circuit boards. Through wire bonding, the I/O on the chip is secured to the PCB. Epoxy resin is used to encapsulate the chips to prevent breakage or bending of the thin wires. The PCBs are placed in ovens for the resins to harden in order to offer adequate protection to the chips and wire.

Housed in an ESD-free clean room environment, our bonding department is equipped with 6 bonding machines, one CNC controlled die setting machine, one CNC controlled encapsulation machine and three ovens.